Forge Nano, Inc., a number one ALD tools supplier and supplies science firm, right now additional expanded into the semiconductor market with the disclosing of its new Atomic Layer Deposition (ALD) product providing – TEPHRA™ – Forge Nano’s new single-wafer, ALD cluster platform. By providing single-wafer ALD coating high quality at throughputs much like the pace of batch programs, Forge Nano’s TEPHRA ™ will enable prospects to supply best-in-class coatings at business scale with unmatched precursor effectivity and pace.
Picture Credit score: Forge Nano, Inc.
Powered by Forge Nano’s ALDx expertise, which affords ultrathin, uniform, pinhole-free movies with an unprecedented 10x throughput for single-wafer processing, TEPHRA is devoted to the manufacturing of specialty semiconductor functions on 200mm wafers and under. With 100x environment friendly chemical use, fast cycle instances, elevated yield, and low-risk manufacturing, TEPHRA is the one single-wafer cluster device with business throughput speeds serving functions in superior packaging, energy semiconductor, radio frequency gadgets (RFD), microLEDs, microelectromechanical programs (MEMS), and extra.
“TEPHRA is designed to unlock new capabilities to meet the growing demand of novel More-than-Moore market device applications that seek high-throughput ALD capabilities without sacrificing film qualities. Forge Nano will enable advanced device architectures with groundbreaking efficiency in the semiconductor space with our innovative ALD wafer tools that prioritize cost, performance and efficiency,” mentioned Paul Lichty, CEO of Forge Nano. “With TEPHRA, Forge Nano is opening new coating solutions and opportunities for our proprietary coating techniques that address high aspect ratio structures, which have previously been underserved in the semiconductor industry.”
Forge Nano’s ALDx expertise allows conformal coatings to scale to side ratios better than 10:1. With a flagship all-ALD Steel Barrier Seed movie utility, TEPHRA affords nitride and metallic depositions in excessive side ratio constructions for superior 3D integration functions, together with by means of silicon and thru glass vias. By shifting past 10:1 side ratios, producers can scale their packaging processes and scale back energy consumption by overcoming widespread pitfalls of directional deposition applied sciences, together with PEALD, which wrestle with conformality and void formation.
TEPHRA is obtainable in a variety of configurations with the choice for four-sided, six-sided and eight-sided cluster platforms. TEPHRA can course of wafers as much as 200 mm between 80 and 300°C with six course of precursor channels and devoted chambers for oxide, nitride and metallic depositions. TEPHRA ™ additionally options Forge Nano’s patented CRISP expertise, a set of catalyzed thermal ALD processes that allow low temperature and hard-to-deposit supplies with out the necessity for plasma.
For extra info on Forge Nano’s TEPHRA ™ product, go to the TEPHRA product web page at: https://www.forgenano.com/merchandise/tephra. SEMICON West 2024 attendees can cease by the Forge Nano sales space (#133), positioned within the south exhibition corridor, for added product info and to debate capabilities with our product specialists.
Supply:
http://www.forgenano.com/