New Wafer Levels and Extremely-Precision Movement Techniques at Semicon West, July 9 – 11, in San Francisco, CA – Uplaza

Expertise PI’s new piezo wafer phases, granite-based multi-axis techniques for skinny movie metrology, air bearing phases, laser beam steering techniques, and sub-nanometer precision piezo phases, backed by a long time of nanopositioning expertise.

San Francisco, CA – PI’s sales space on the 2024 Semicon West (#332) will give attention to excessive precision multi-axis wafer phases, piezo wafer metrology phases, and air bearing phases for metrology and wafer stealth dicing. We can even present alignment techniques for silicon photonics purposes and high-speed beam steering techniques for laser beam supply. For purposes similar to floor metrology, quick nano-focus phases can be found with a alternative of piezo and voice coil motors.

Picture Credit score: PI (Physik Instrumente) LP

PI’s excessive precision options and movement techniques discover purposes in nano-lithography, laser optics, masks inspection, CD measurement, wafer inspection and metrology, and wafer dicing. PI focuses on world progress markets similar to Semiconductor Manufacturing, Silicon Photonics, Quantum Computing, Industrial Automation, Excessive Decision Microscopy, and Life Sciences.

Can’t make it to San Francisco? You may check out a wide range of efficiency automation for semicon, photonics, and nanopositioning purposes coated by PI system applied sciences.

Industries Served
Semiconductors, Silicon Photonics, Quantum Computing, Industrial Automation, Microscopy, Life Sciences

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