Nordic Semiconductor has introduced the launch of a Wafer-Stage Chip Scale Bundle (WLCSP) model of its nRF7002 Wi-Fi 6 Companion IC. The brand new bundle choice affords the identical performance because the nRF7002 QFN variant however with a footprint discount of over 60%.
The nRF7002 WLCSP helps superior Wi-Fi 6 capabilities together with OFDMA and Goal Wake Time (TWT), offering strong and environment friendly wi-fi connectivity. The IC is optimised for extremely low energy operation, making certain longer battery life for linked gadgets. Its smaller type issue gives builders with a Wi-Fi answer appropriate for space-constrained purposes akin to modules, wearables and moveable medical gadgets.
Including the bundle to the nRF7002 household gives our prospects with a flexible and compact answer that meets the rising calls for for smaller, extra power-efficient IoT gadgets Joakim Ferm, the SVP Wi-Fi BU at Nordic Semiconductor
Totally built-in with Nordic’s wi-fi product portfolio
The nRF7002 Wi-Fi 6 companion IC integrates with Nordic’s award-winning nRF91 Sequence Programs in Bundle (SiPs), nRF52 and nRF53 Sequence multiprotocol Programs-on-Chip (SoCs), and the upcoming nRF54L and nRF54H Sequence SoCs. This integration ensures builders can entry the total potential of Wi-Fi 6—together with larger knowledge charges, elevated capability and improved energy effectivity—alongside Nordic’s best-in-class LTE-M/NB-IoT and Bluetooth LE options – simplifying improvement and accelerating time-to-market.
“We are excited to offer the nRF7002 in a WLCSP package. Adding the package to the nRF7002 family provides our customers with a versatile and compact solution that meets the growing demands for smaller, more power-efficient IoT devices,” mentioned Joakim Ferm, the SVP Wi-Fi BU, Nordic Semiconductor. “This new option underscores our commitment to Wi-Fi and to delivering connectivity solutions that enable our customers to push the boundaries of what’s possible in wireless design.”
The WLCSP model of the nRF7002 (nRF7002 CEAA) is now in quantity manufacturing and accessible from distributors.
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